Failure Analysis for Electronic Devices & Components Services

Element's extensive testing capabilities for electronics failure analysis include:

• Ball Shear and Die Shear Testing
• Curve Trace
• Decapsulation (De-Cap)
• Design of Experiments (DOE)
• Differential Scanning Calorimetry (DSC)
• Dynamic Mechanical Analysis (DMA)
• Electrical Characterization
• Fourier Transform Interferometry (FTIR)
• Fracture Evaluation
• Level I Analysis
• Material Characterization
• Microsectional Analysis (Cross-Section)
• Optical Inspection and external package analysis
• Scanning Acoustic Microscopy (CSAM)
• Scanning Electron Microscopy (SEM/EDS)
• Solderability
• Thermal Gravimetric Analysis (TGA)
• Thermal Mechanical Analysis (TMA)
• Wire bond pull testing
• X-Ray (Live-time, non-destructive inspection of package)
• X-Ray Fluorescence (XRF)

We employ design of experiments (DOE) methodology and provide detailed material characterization to ensure thorough understanding of failure modes and prevention strategies.

From raw materials to fully assembled products, we analyze every aspect of your electronic components. Our expertise covers integrated circuits, PCBs, passive surface mount devices, and complete electronic assemblies. Whether you're developing cutting-edge technology or maintaining trusted industry workhorses, we provide comprehensive evaluation of performance limitations and reliability factors.

Access advanced analytical tools including Scanning Electron Microscopy (SEM/EDS), X-Ray analysis with live-time non-destructive inspection, Scanning Acoustic Microscopy (CSAM), and comprehensive thermal analysis equipment (DSC, DMA, TGA, TMA). Our state-of-the-art facilities ensure precise, reliable results.

Notably among our circuit board testing labs around the world, our Anaheim, CA and Baltimore, MD labs, formerly known as Microtek and Trace Labs, have more than 30 years of experience partnering with leading OEMs and manufacturers.