Printed Circuit Board (PCB) Testing

Element’s Printed Circuit Board Testing provides end-to-end testing solutions for PCBs, PCB assemblies and electronic components. Our state-of-the-art laboratories combine advanced technology like HATS2™ with expert analysis to help you prevent costly recalls, protect against counterfeits, and streamline your testing process. From early chip design to volume production, Element are the trusted partner for all your PCB testing needs, backed by 30+ years of expertise.

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What is Printed Circuit Board (PCB) Testing at Element?

PCB testing is a manufacturing process to evaluate whether printed circuit boards and assemblies meet quality standards and are fit for purpose. At Element, we provide end-to-end testing solutions including expert analysis to validate components, ensure functionality, and perform failure analysis. We deliver comprehensive testing from raw materials through finished assemblies, helping you maintain quality while meeting industry standards and preventing costly recalls.

Element testing technician holding SAR head phantom for mobile phone radiation testing and certification

What can Element offer you for PCB Testing?

Components and materials we test

Support your entire PCB production cycle with comprehensive testing of raw materials, bare PCBs, and finished assemblies. Our expertise covers copper purity testing, laminate material qualification, conformal coating verification, and soldermask evaluation. We specialize in detecting counterfeit components through advanced inspection methods, protecting your supply chain integrity.

Key tests offered

Highly Accelerated Thermal Shock (HATS2™) Testing: A proprietary technology for faster, more reliable thermal shock testing.
Cross-Sectioning Analysis: Detects solder joint cracks, voids, lamination defects, poor wetting, land lift, and insufficient solder fill.
Electrical Characterization: Detailed electrical performance evaluation.
Microsection Analysis: Analysis as received, after thermal stress, thermal shock, or rework simulation.
Root Cause Analysis: Comprehensive failure investigation to identify and resolve issues.
Ball Shear Testing: Specialized technique for material integrity assessment.
Wire Bond Pull Testing: Ensures bond reliability.
Dynamic Mechanical Analysis (DMA): Material characterization under dynamic conditions.
Thermal Analysis: Techniques such as DSC, TMA, TGA for evaluating thermal properties.
Fourier Transform Infrared Spectroscopy (FTIR): Advanced material characterization method.
Scanning Electron Microscopy with Energy-Dispersive X-Ray Spectroscopy (SEM/EDS): High-resolution material analysis.
Consultancy Services: Expert support for failure analysis and performance optimization.

Methods and solutions offered

Visual Inspection

Mechanical Integrity
Solder Cracking
Burn Marks and Discoloration
Foreign Object Debris
Whisker Formation
Dendritic Growth
Flux Residue (IPC-A-610)

Material Quality and Conformance Testing

Raw Material Analysis: Evaluates PCB and PCA material properties.
Advanced Instrumentation: FTIR, SEM/EDS, Real-Time X-Ray.
Copper Testing: Purity, Tensile Strength, and Elongation.
Flammability Testing: IPC-4101 qualification for laminate materials.
Surface Insulation Resistance (SIR): Testing for material reliability.
Conductive Anodic Filament (CAF): Assessment of conductive pathways.
Electrochemical Migration (ECM): Evaluates potential for dendritic growth.
Thermal Analysis: Time to delamination, Coefficient of Thermal Expansion (CTE), Glass Transition Temperature (Tg / ΔTg).
Conformal Coating Tests: IPC-CC-830 or MIL-I-46058 compliance.
Soldermask Testing: IPC-SM-840 compliance.

Reliability and Performance Tests

Continuity Testing: Verification of electrical paths.
Dielectric Withstanding Voltage: Evaluates insulation strength.
Dimensional Inspection and Verification: Precision measurements for PCB conformance.
Flexural Endurance and Folding Flexibility: Durability under stress.
Ionic Cleanliness / Resistivity of Solvent Extract (ROSE): Contamination evaluation.
Moisture and Insulation Resistance (IR / MIR): Assessing resistance to environmental exposure.
Peel Strength: Adhesion quality of PCB layers.
Resistance to Solvents: Marking ink durability testing.
Solderability Testing (J-STD-003): Ensures solder wetting properties.
Thermal Cycling: Reliability testing under temperature variation.
Visual Examination: Per IPC-A-600 and IPC-A-610 standards.

Qualification and Conformance Testing

PCB qualification testing for new suppliers or manufacturing process changes.
Conformance testing schedules: Quarterly for Class 2, monthly for Class 3.
Acceptance testing: Conducted per lot.
Military specification testing: Performed on a three-year schedule.

Cutting-edge equipment we use

Utilize advanced instrumentation including FTIR, SEM/EDS, Real-Time X-Ray, and Scanning Acoustic Microscopy. Our HATS2™ technology provides superior thermal shock testing with continuous monitoring capabilities. Equipment includes high-speed precision resistance sampling networks and advanced cross-sectioning tools.

Which labs offer this service

Notably among our circuit board testing labs worldwide, our Anaheim, CA and Baltimore, MD labs, formerly known as Microtek and Trace Labs, have more than 30 years of experience partnering with leading OEMs and manufacturers.

Standards we test to and materials we test

These are our most prevalent requests. Don't see what you're looking for? Contact us!

IPC-6012, IPC-6013, IPC-6016, IPC-6018

MIL-PRF-55110

MIL-P-50884

MIL-PRF-31032

IPC-A-610

J-STD-003

IPC-4101

IPC-CC-830

MIL-I-46058

IPC-SM-840

Your Challenges, Our Solutions

Costly Product Failures

Prevent expensive recalls through comprehensive testing at every stage, from raw materials to finished assemblies, with expert analysis and early defect detection.

Counterfeit Component Threats

Protect your supply chain with our advanced authentication methods, combining multiple verification techniques to accurately identify counterfeit parts.

Time-Consuming Testing

Processes Accelerate your testing cycle with our proprietary HATS2™ technology, delivering faster results while maintaining superior accuracy and reliability.

Complex Compliance Requirements

Navigate industry standards confidently with our accredited testing services covering all major specifications and compliance requirements.

Why Choose Element

Element testing engineer in anechoic chamber for electromagnetic compatibility and wireless device testing

Industry-Leading Experience

30+ years of PCB testing expertise and continuous innovation in testing methods.

Comprehensive Testing Solutions

All PCB testing services under one roof, from raw materials to finished assemblies.

Advanced Technology Partner

Exclusive HATS2™ technology delivers faster, more reliable thermal shock testing.

Global Testing Network

Worldwide laboratory coverage with consistent standards and local support.

30+
Years Experience

Industry-leading expertise

2003
Launch

of HATS2™ technology innovation

7
Global Regions

Worldwide coverage

20+
Testing Methods

Comprehensive solutions

Element engineer monitoring SAR equipment during technology testing

Frequently asked questions

What types of PCB visual assessments do you perform?

We use IPC-A-610 to assess mechanical integrity, solder cracking, burn marks, discoloration, foreign object debris, whisker formation, dendritic growth, and flux residue on printed circuit boards.

What is HATS2™ testing?

HATS2™ (Highly Accelerated Thermal Shock) is a fast, reliable method for thermal shock testing. It uses extremely hot or cold air on stationary samples, enabling continuous resistance monitoring and precise detection of “glitch” conditions. Unlike traditional dual-chamber methods, HATS2™ reduces cycle time and eliminates costly sample transfers. In use since 2003, it supports in-situ convection reflow simulation and meets MIL-STD-202 Method 107 and IPC-TM-650 standards for thermal shock and reflow assembly simulations.

What is the difference between a PCB and a PCA?

The terms PCB (Printed Circuit Board) and PCA (Printed Circuit Assembly) refer to different stages in the lifecycle of circuit boards:

PCB is the bare board with conductive pathways, serving as the base for electronic components. A PCA is the assembled version of the PCB with all components installed, making it functional.

Summary of the Difference:

Aspect	PCB	PCA (PCBA)
Definition	Bare board with traces and vias.	PCB with components assembled.
Components	No components.	Includes all necessary components.
Functionality	Non-functional on its own.	Fully functional when powered.