Tin Whisker Testing

Element employs a unique staged testing approach to tin whisker testing, incorporating three key environmental exposures:

• temperature cycling
• ambient temperature-humidity storage
• high temperature-humidity storage.  

Our cost-efficient methodology starts with optical screening inspections at the beginning and each designated interval - if no whiskers are found during screening, we typically won't recommend further testing, providing significant cost savings. However, if evidence appears, we proceed to detailed SEM analysis. Any mitigation strategy depends on your particular device, and testing is crucial to determine if your approach proves effective.

Our testing capabilities cover all electronic components where pure tin is used as a finish material, particularly focusing on lead-free alternatives required by RoHS compliance. The RoHS directive banned lead solder, requiring manufacturers to switch to lead-free alternatives, which unfortunately increases tin whisker growth risk. We test various tin finishes including matte and low-stress options, as well as components with conformal coating protection.

Our laboratories are equipped with state-of-the-art optical stereomicroscopes for initial screening and scanning electron microscopes (SEM) for detailed surface analysis, enabling precise detection of whisker growth, surface anomalies, and contamination.  

Notably among our circuit board testing labs worldwide, our Anaheim, CA and Baltimore, MD labs, formerly known as Microtek and Trace Labs, are centers of excellence. We have more than 30 years of experience partnering with leading OEMs and manufacturers.